Scheme features

High-Precision mounting technology

High-Precision mounting is also called pick&place technology.

It can be widely used in the mounting process of various electronic products, such as chips, filters, lenses, brackets, covers, etc,

This technology is a process to attach devices to the substrate by visually positioning and dispensing the product substrate on the platform.

Camera module, which is composed of lens, sensor, image processing chip, focusing motor, filter, FPC/PCB and other components, shall be mounted to ensure its mounting accuracy and output efficiency. Its complexity and difficulty coefficient are very large, and the requirements for mounting equipment are very high.

High-Precision mounting equipment of AIT: XY position degree ± 10um, rotation accuracy ± 0.2 °; UPH≥3500

It can be applied to the following precision mounting: chip, IR Filter, lens, VCM motor, iron case, bracket, etc.